asmt-qxbc-nxxxx super 0.5w power plcc-4 surface mount led indicator data sheet description the super 0.5w power plcc-4 smt led is blue mid-power plcc-4 smt leds using ingan chip technology. the package can be driven at high current due to its superior package design. the product is able to dissipate the heat more e?ciently compared to the power plcc-4 smt leds. these leds produce higher light output with better ?ux performance compared to the power plcc-4 smt led. the super 0.5w power plcc-4 smt leds are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. the perfor- mance characteristics of these new mid-power leds make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel is shipped in single intensity and color bin, to provide close uniformity. features industry standard plcc 4 platform (3.2x2.8x1.9mm) high reliability package with enhanced silicone resin encapsulation high brightness with optimum ?ux performance using ingan chip technologies available in blue color available in 8mm carrier tape & 7 inch reel low thermal resistance 40c/w wide viewing angle at 120 degree jedec msl 2 applications 1. electronic signs and signals a. decorative/advertising lighting b. channel lettering c. signs luminaire d. rgb backlighting caution: asmt-qxbc-nxxxx leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details.
2 package drawing notes: 1. all dimensions in millimeters. 2. lead polarity as shown in figure 13. 3. terminal finish: ag plating 4. encapsulation material: silicone resin table 1. device selection guide (t j = 25c) color part number luminous flux, v [1] (lm) dice technology min. flux (lm) typ. flux (lm) max. flux (lm) test current (ma) blue asmt-qbbc-nacxe 4.3 7.0 9.0 150 ingan notes: 1. v is the total luminous ?ux output as measured with an integrating sphere at mono pulse conditions. 2. tolerance = 12% 3.6 0.2 0.7 3.2 0.2 2.8 0.2 2.2 0.2 1.9 0.2 0.6 0.3 c c aa 0.79 0.3 cathode marking 2.4 1.15 0.2 0.41 (typ.) 0.56 (typ.) 0.97 part numbering system asm t - q x 1 b c C n x 2 x 3 x 4 x 5 packaging op t ion co l or bin se l ec t ion max. fl ux bin se l ec t ion min. fl ux bin se l ec t ion co l or b C b l ue figure 1. package drawing
3 table 2. absolute maximum ratings (t a = 25c) parameters asmt-qxbc-nxxxx dc forward current [1] 150 ma peak forward current [2] 300 ma power dissipation 570 mw reverse voltage, v r @ 10 a 4 junction temperature 125c operating temperature -40c to +120c storage temperature -40c to +120c notes: 1. derate linearly as shown in figure 6. 2. duty factor = 10%, frequency = 1khz table 3. optical characteristics (t j = 25c) color part number dice technology peak wavelength peak (nm) dominant wavelength d (nm) viewing angle 2 ? [1] (degrees) luminous e?ciency e (lm/w) total flux / lumi- nous intensity v (lm) / i v (cd) typ. typ. typ. typ. typ. blue asmt-qbbc-nxxxx ingan 458.0 464.0 120 10 2.70 notes: 1. ? is the o?-axis angle where the luminous intensity is ? the peak intensity. table 4. electrical characteristics (t j = 25c) part number forward voltage v f (volts) @ i f = 150 ma thermal resistance r j-p (c/w) typ. max. asmt-qbbc-nxxxe 3.4 3.8 40
4 figure 2. relative intensity vs. wavelength figure 3. forward current vs. forward voltage. figure 4. relative flux vs. forward current figure 5. relative flux vs. temperature figure 6a. maximum forward current vs. ambient temperature. derated based on t jmax = 125c, r j-a = 110c/w & 90c/w. figure 6b. maximum forward current vs. solder point temperature. derated based on t jmax = 125c, r j-p = 40c/w. 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 .0 380 430 480 530 580 630 680 730 780 waveleng th - nm rela ti ve i n t ens it y 0 50 1 00 1 50 200 250 300 0 1 234 f orward vol t age - v f orward c u rren t - ma 0.0 0.2 0.4 0.6 0.8 1 .0 1 .2 1 .4 1 .6 1 .8 050 1 00 1 50 200 250 300 dc f orward c u rren t - ma rela ti ve l u m i no u s f l u x (normal iz ed a t 1 50 ma) 0.0 0.2 0.4 0.6 0.8 1 .0 1 .2 - 50 - 25 0255075 1 00 t j - j u nc ti on t empera tu re - c normal iz ed l u m i no u s i n t ens it y (normal iz ed a t 25c) 0 20 40 60 80 1 00 1 20 1 40 1 60 020406080 1 00 1 40 1 20 c u rren t - ma r ja = 11 0c/w 0 20 40 60 80 1 00 1 20 1 40 1 60 020406080 1 00 1 20 1 40 t empera tu re (c) c u rren t - ma r jp = 40c/w r ja = 90c/w
5 figure 7a. maximum pulse current vs. ambient temperature. derated based on t a = 25c, r j-a = 110c/w. figure 7b. maximum pulse current vs. ambient temperature. derated based on t a = 85c, r j-a = 110c/w. figure 8. chromaticity shift vs. forward current f igure 9. forward voltage shift vs. temperature. figure 10. radiation pattern - 0.20 - 0. 1 5 - 0. 1 0 - 0.05 0.00 0.05 0. 1 0 0. 1 5 0.20 0.25 - 50 - 25 0 25 50 75 1 00 t j - j u nc ti on t empera tu re - c f orward vol t age s hift - v 440 450 460 470 480 490 500 5 1 0 050 1 00 1 50 200 250 300 f orward c u rren t - ma dom i nan t waveleng th - nm 0.0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 .0 - 90 - 60 - 300 306090 ang u lar d i splacemen t - degrees normal iz ed i n t ens it y 0.00 0. 1 0 0.20 0.30 0.40 1 .00e - 05 1 .00e - 04 1 .00e - 03 1 .00e - 02 1 .00e - 0 11 .00e + 00 1 .00e + 0 11 .00e + 02 t - t ime - (s) c u rren t - a 0.00 0. 1 0 0.20 0.30 0.40 1 .00e - 05 1 .00e - 04 1 .00e - 03 1 .00e - 02 1 .00e - 0 11 .00e + 00 1 .00e + 0 11 .00e + 02 t p - t ime - (s) c u rren t - a d = t p t t p i f t d = t p t t p i f t d = 0.05 0. 1 0 0.25 0.50 1 d = 0.05 0. 1 0 0.25 0.50 1
6 (acc. to j-std-020c) 217c 200c 60 - 120 sec. 6c/sec. max. 3c/sec. max. 3c/sec. max. 150c 255 - 260c 100 sec. max. 10 - 30 sec. time temperat u re figure 12. recommended pb-free re?ow soldering pro?le note: for detail information on re?ow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components. figure 13. recommended soldering pad pattern note: diameter "d" should be smaller than 2.2mm d figure 11. recommended pick and place nozzle size ca th ode mark i ng ca th ode mark i ng a c a a c c c c solder mask anode ca th ode 0.4 0.3 m i n i m u m 55 mm 2 o f ca th ode pad f or i mproved h ea t d i ss i pa ti on 2.4 0.6 0.9 x 6 4.6 1 . 1 1 .3 x 6 aa cc
7 figure 14. tape leader and trailer dimensions 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 960 mm min. for ? 330 reel. c a u ser feed direction figure 15. tape dimensions cathode side u ser feed direction printed label figure 16. reeling orientation 3.8 0. 1 2.29 0. 1 0.229 0.0 1 all d i mens i ons i n mm. 2 0.05 4 0. 1 4 0. 1 3.05 0. 1 3.5 0.05 8 + 0.3 C 0. 1 1 .75 0. 1 ? 1 .5 + 0. 1 C 0 8 ? 1 + 0. 1 C 0 aa cc
8 device color (x 1 ) b blue flux bin select (x 2 x 3 ) individual reel will contain parts from one bin only x 2 min flux bin x 3 max flux bin flux bin limits bin id min. (lm) max. (lm) 0 3.40 4.30 a 4.30 5.50 b 5.50 7.00 c 7.00 9.00 d 9.00 11.50 e 11.50 15.00 f 15.00 19.50 g 19.50 25.50 h 25.50 33.00 j 33.00 43.00 k 43.00 56.00 l 56.00 73.00 tolerance of each bin limit = 12% color bin select (x4) individual reel will contain parts from one full bin only. x4 0 full distribution a 1 and 2 only b 2 and 3 only c 3 and 4 only g 1, 2 and 3 only h 2, 3 and 4 only z special binning color bin limits blue min. (nm) max. (nm) 1 460.0 465.0 2 465.0 470.0 3 470.0 475.0 4 475.0 480.0 tolerance of each bin limit = 1 nm v f bin limits bin id min. max. s4 2.90 3.20 s5 3.20 3.50 s6 3.50 3.80 tolerance of each bin limit = 0.1v packaging option (x 5 ) option test current package type reel size e 150ma top mount 7 inch
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1885en - april 8, 2010 handling precaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an 5288 for detail information. moisture sensitivity this product is quali?ed as moisture sensitive level 2 per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use C unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to re?ow the leds per the original msl rating. C it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb C the humidity indicator card (hic) shall be read immediately upon opening of mbb. C the leds must be kept at <30c / 60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 1 year. c. control for un?nished reel C for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembly boards C if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their ?oor life of 1 year. e. baking is required if C 60% hic indicator is not green. C the leds are exposed to condition of >30c/60% rh at any time. C the leds ?oor life exceeded 1 year. recommended baking condition: 605c for 20 hours.
|
